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Electronics Repair (sci.electronics.repair) Discussion of repairing electronic equipment. Topics include requests for assistance, where to obtain servicing information and parts, techniques for diagnosis and repair, and annecdotes about success, failures and problems. |
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Eeyore wrote in message
... N_Cook wrote: For fan blown o/p devices the heatsink surely does not have to be much more that a metal matrix for holding the devices to. The larger area the better. Does not have to be multifluted That certainly helps. or with those chisseled multi-vanes etc (sorry don't know the generic term , end up curved ) Those increase surface area which is a GOOD THING. or a great mass of metal for convection cooling It most certainly DOES NOT need to have great weight. But almost none of the colling in SR amp is classic convection anyway. What typically helps is maximum surface area of the fins/vanes to create the best opportunity to let the heat transfer to the air flow, but you can improve even that by 'slotting' the 'vanes' to create a slightly turbulent air flow. Trust me I could write a lecture on the subject. Graham Anyone know the generic name for this type of what I assume is chisel-action-cut vaned heatsink. Is it made using a shaper type machine with some sort of chisel or plane blade? http://home.graffiti.net/diverse:gra...e_heatsink.jpg -- Diverse Devices, Southampton, England electronic hints and repair briefs , schematics/manuals list on http://home.graffiti.net/diverse:graffiti.net/ |
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