** For John Popelish


Motorola brand device comes from my collection of
TO3 pack " corpses " .....

- JPEGs taken only a few minutes ago.





...... Phil

"Phil Allison"


** The device shown in my pics is a TO3 pack " MJ21194 ", a NPN device.

The " MJL21194 " is the plastic, flat pack version.

The chips used are exactly the same in both.




....... Phil

Phil Allison wrote:
** For John Popelish


Motorola brand device comes from my collection of
TO3 pack " corpses " .....

- JPEGs taken only a few minutes ago.

Thank you so much for these. I am beginning to suspect a
bit of hype in the "perforated Emitter technology" bragging.
Those look very similar to many other interdigitated power
transistor die I have seen. I would have thought
"perforations" would have involved holes.

"John Popelish"
Phil Allison wrote:

** For John Popelish


Motorola brand device comes from my collection of
TO3 pack " corpses " .....

- JPEGs taken only a few minutes ago.

Thank you so much for these. I am beginning to suspect a bit of hype in
the "perforated Emitter technology" bragging. Those look very similar to
many other interdigitated power transistor die I have seen. I would have
thought "perforations" would have involved holes.


** Maybe they are hidden from view - or maybe there simply aren't any.

The phrase " Perforated Emitter technology " can allude to any number of
side developments that accompanied the original research.



...... Phil

John Popelish wrote:

Phil Allison wrote:
** For John Popelish


Motorola brand device comes from my collection of
TO3 pack " corpses " .....

- JPEGs taken only a few minutes ago.

Thank you so much for these. I am beginning to suspect a
bit of hype in the "perforated Emitter technology" bragging.
Those look very similar to many other interdigitated power
transistor die I have seen. I would have thought
"perforations" would have involved holes.

It sounds as if the process is similar to the 'mesh emitter' type.
http://europe.elecdesign.com/Files/3.../Figure_01.gif

Graham