bz wrote in message
98.139...
"N_Cook" wrote in -
september.org:

N_Cook wrote in message
...
Just found 4 PbF faults on a 2003 AS50R, no mention of RoHS/PbF on the
pcb
as pre-2006. Distortion after an hour of normal use
Appearance probably but not definitively PbF, shallow cones rather than
domes but no pastey/crackle-finish or white blotchiness. Anyone have
any
precise knowledge about their first using date?

I'm thinking of using my never used thermocouple monitored variable
temp
OK
....

I think I would use a hot air gun with digital temp control such as
http://www.web-tronics.com/hotairgunwdi.html

I have one of these and find it to be quite useful for soldering and
desoldering.


You may find the following table useful:

[quote]
C F
183 361.4 63/37 It has the lowest melting point (183 °C or 361.4 °F)
of all the tin/lead alloys; and
220 428 SnAg3.0Cu0.5, tin with 3% silver and 0.5% copper, has a
melting point of 217 to 220 °C
218 424.4 SnAg3.5Cu0.7 is another commonly used alloy, with melting
point of 217-218 °C.
217 422.6 SnAg3.5Cu0.9, with melting point of 217 °C, is determined
by NIST to be truly eutectic.
218 424.4 SnAg3.8Cu0.7, with melting point 217-218 °C, is preferred
by the European IDEALS consortium for reflow soldering.
223 433.4 SnAg3.8Cu0.7Sb0.25 is preferred by the European IDEALS
consortium for wave soldering.
32 SnAg3.9Cu0.6, with melting point 217-223 °C, is recommended by
the US NEMI consortium for reflow soldering.
32
227 440.6 SnCu0.7, with melting point of 227 °C, is a cheap
alternative for wave soldering, recommended by the US NEMI consortium.
199 390.2 SnZn9, with melting point of 199 °C, is a cheaper alloy
but
is prone to corrosion and oxidation.
198 388.4 SnZn8Bi3, with melting point of 191-198 °C, is also prone
to corrosion and oxidation due to its zinc content.
240 464 SnSb5, tin with 5% of antimony, is the US plumbing industry
standard. Its melting point is 232-240 °C. It displays good resistance to
thermal fatigue and good shear strength.
225 437 SnAg2.5Cu0.8Sb0.5 melts at 217-225 °C and is patented by AIM
alliance.
208 406.4 SnIn8.0Ag3.5Bi0.5 melts at 197 to 208 °C and is patented
by
Matsu****a/Panasonic.
139 282.2 SnBi57Ag1 melts at 137-139 °C and is patented by Motorola.
138 280.4 SnBi58 melts at 138 °C.
118 244.4 SnIn52 melts at 118 °C and is suitable for the cases where
low-temperature soldering is needed.
[unquote]


--
bz 73 de N5BZ k

please pardon my infinite ignorance, the set-of-things-I-do-not-know is an
infinite set.


Which would be likely most common PbF in consumer goods ? presumably the 227
°C cheap one