"ian field" wrote in
:


"Tom Del Rosso" wrote in message
...

"ian field" wrote in message


Most electronics tool suppliers stock pencil blowlamps which would be
precise enough to desolder a decent size ceramic chip, some are sold
in sets with a variety of nozzle attachments. The spread is way more
precise than a heat gun.

I think he's saying that you can't apply heat to the component side at
all,
even if it's directed only at the target device, because the package in
question is a hybrid with SMT parts exposed on its own surface.


If its going in the bin once removed, that hardly matters.




if you are removing it,it's likely because it's bad,and I would not try to
salvage such a part for reuse on another board.
I'm not even sure that BGA parts CAN be reused.(reliably)

I note manufacturers rework BGA boards by that "preheat and hot air"
method.

--
Jim Yanik
jyanik
at
kua.net