"ian field" wrote in message


Most electronics tool suppliers stock pencil blowlamps which would be
precise enough to desolder a decent size ceramic chip, some are sold
in sets with a variety of nozzle attachments. The spread is way more
precise than a heat gun.

I think he's saying that you can't apply heat to the component side at all,
even if it's directed only at the target device, because the package in
question is a hybrid with SMT parts exposed on its own surface.


For smaller chips it might be worth looking out for one of those
"windproof" lighters that uses the same design of jet as the pencil
blowlamp - only smaller.


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