"Phil Allison" wrote in
:


"Bob Quintal"


Sorry to say no, there is a lifted bond on the base of the right
die, there is die attach material on three of the bond wires, the
emitter post wedge bonds are crossed over. The other base bond
overlaps an emitter finger.

And I'll be generous and claim that the kinks in the bond wires
were due to poor delidding technique.


** So you missed the white silicone all over everything ??

I did say "there is die attach material on three of the bond wires",
It quite possibly is white silicone RTV. Not having see the specimen
prior to removal of the silicone, I wasn't sure what the stuff was.
BTW silicone products are usually forbidden inside of hermetic
packages, because the gasses they emit, even after curing, are known
to etch metalization from die.

And I apologize, about Poor delidding technique, With silicone
gooped over everything, it would be impossible to decapsulate the
device without mangling the bonds.


Both chips were hidden under a blob of white, which I had to
remove best as possible with a jeweller's driver.

Hence the detached base wire.

I apologize about poor delidding technique, With silicone gooped
over everything, it would be impossible to decapsulate the device
without mangling the bonds.


BTW

The device passed basic tests like Vce, Hfe and Ic sat prior to
being opened.

I've seen things like that, where the transistor met electrical
specifications, but everybody who saw it was incredulous that it
worked at all.


...... Phil

--
Bob Quintal

PA is y I've altered my email address.

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