Joerg wrote:
John Popelish wrote:

This graphic is something I drew after thinking about the multi 0102
SMT bypass capacitor thread in sci.electronics.design. Is there a
better way to bring a supply in (from the top) past several SMT bypass
capacitors? The vias on both sides are to the ground layer.

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Yep, by having the vias to the ground plane in the pads. But be prepared
for some eggs and tomatoes flying,

Not familiar with that technical expression.

from the production folks. At least
make the ground traces there wider, a little "mini plane".

I don't see the value in a mini plane connected to the
buried plane with vias, but I can see that using a wider
trace that surrounds 3 sides of the capacitor ground pad
would lower the inductance of that path to the via.

A lot of the details of this sort of layout depend on the
rules for the PCB process (minimum solder mask width,
minimum distance between via and pad, etc.)