On 2019/09/17 8:03 p.m., Jeff Urban wrote:
I did check that the chip was under some
compression against the heat sink prior to using the compound, and we polished the contact face of the heatsink hoping to get a slightly better heat transfer. I assume (hope) that was a good idea..

Another thing about heatsink compound, otherwise known as bird**** is you do not spread it. You put it at the center of the pressure and squeeze it, this does not make air pockets. Air pockets defeat the whole purpose, enough of them you might as well put it on dry, or maybe lick it.

When I fix the high power **** it stays fixed.


Thanks for the note, yes, that was what I did, just a large drop in the
middle then compress evenly.

John :-#)#