Commercially we use both designs of the Hakko equipment, the Pistol type
and the Base type. Both do a fair job but tend to plug us a lot,causing the
user to constantly use the supplied cleaning rod to clean the debris out of
the pickup tube, tips, and emptying the reservoirs. I have seen the PASS
system installed in many rework facilities ant that system works remarkably
well for production applications.
For the average hobbyist, home user, etc IMHO the Teflon tipped solder
sucker, bulb operated, is preferred in many applications, with the
application of liquid flux when required. As stated, larger amounts of
material can be more easily removed with the Copper Braid method. I
personally use both depending on need. Also, the temperature of the iron has
a lot to do with the physical functions, too much heat and you will damage
the board, print,and/or components. Too little heat and the solder will not
flow nor be removed efficiently, which also may cause damage to the
connections, pads, etc.
Best to try both methods and become proficient in their appropriate
applications. Safe and Happy 2005 to all.
"James Sweet" wrote in message
news:Eu8Bd.25912$h.18949@trnddc04...

"Robert Wolcott" wrote in message
...
What is the best method for desoldering components on circuit boards? I
know that there is the bulb method that sucks up the solder, and the
braided
copper wire that wicks it up. Which is generally preferred?

Thanks,
Bob



Depends on what you're doing. I've found the Radio Shack desoldering iron
to
be the best cheap solution, desoldering braid (and a bottle of liquid
flux)
is handy to have around. Nothing else I've tried short of a $400 Hakko
vacuum desoldering station has worked worth a darn.