On Tue, 17 Apr 2018 15:06:09 +0100, Andy Burns
wrote:

Brian Gaff wrote:

Its a shame these devices do not have a thermal mounting point to enable the
metal case to cool it.

would get in the way of the expansion connectors (not that everyone uses
those)

Given that we aren't talking about 'loads' of thermal energy here, my
idea was a 'U' of copper strip with one outer face of the flat part of
the U on the chip and the opposite side bolted to the underside of the
case top. Being formed into a (as long as practical) 'U' should
provide a modicum of flexibility and the thickness would be a
compromise between thermal conductivity and allowing said 'give'.

Maybe even brass 'shim' material formed into said 'U' would be better
at conducting the heat away and to the case than the air would with
convection?

Cheers, T i m