Thread
:
Chip failure and air corrossion products
View Single Post
#
6
Posted to sci.electronics.repair
N_Cook
external usenet poster
Posts: 5,247
Chip failure and air corrossion products
On 03/03/2017 17:41,
wrote:
a) Silver Oxide will not form in this case, as copper is sacrificial to silver.
b) Copper Oxide (Cu0) is a semi-conductor, and is also black as described, and under the condition described would have looked like soot. But, as a semi-conductor would have led to all kinds of erratic behavior.
But, that does not take away from your correct conclusion that it would have been enough (for now) just to clean. However, as long as there was now-exposed copper, the process would have continued until all the copper was consumed. By then, all the silver would have been dissipated as well.
Peter Wieck
Melrose Park, PA
All this is one the external sections of the pins? how would these
effects progress into the active die or at least weld-spots ?
This piece of kit was not stored i na damp environment, so no chance of
capilliary action.
Reply With Quote
N_Cook
View Public Profile
Find all posts by N_Cook