"A2" wrote in message
...
On 4/11/2015 12:54 PM, Martin Eastburn wrote:
You need to talk to a fab line production manager - Encapsulation
is their game. They do long wire frames and attach the die, bond and
encapsulate, saw and polish the saw ends. Touch up the part and 'mark'
the numbers... package and ship. in the Mark pack and label group.

Martin


Thanks Martin, we are encapsulating whole PCB assemblies with cables
attached rather than the dies etc. No doubt the IC packaging guys would
have the knowledge we could use! I'm not sure there is even a fab plant in
Australia these days.

I assume you have already accounted for adequate epoxy thickness to kick and
cure easily without being so thick as to overheat and scorch. To thin and
it can be hard to cure without adding heat. To thick and it will over heat
and burn itself.