On 11/01/2014 16:46, Kaz Kylheku wrote:
On 2014-01-11, Doug White wrote:
0.5mm thick abrasive disc or cintride/"diamond" disc in a "Dremmel"

Thus throwing small conductive bits all over the board. No thanks...

Reconsider your objection. You can blow the filings away with compressed air,
and vacuum up.

The board is not powered up while you're doing this, right?

You could also mask the board off with a piece of paper (or whatever) that has
a cutout just for the IC, if you're paranoid.


Its not as though the bits of metal grow dendrite or tin-whisker
fashion. You'd have to be extremly unlucky to end up with a continous
patch of dozens of minute particles forming a continuous path.
Similar situation with solder paste, you cannot guarantee making all
those tiny balls molten and aggregate together as one