On Sun, 27 Oct 2013 11:38:13 -0400, "Tom Del Rosso"
wrote:


legg wrote:

Pins are brazed within the ceramic form. Internal bonds are
stitch-bond gold or Al wire to pad, high temperature solder between
substrate and sputter/print patterned ceramic.

Ceramic carrier is simply reflowed to printed wiring.

See the video. IBM welded the pins to the board without solder, but the
pins are soldered to the hybrid 2mm away.

Didn't watch the video. This machine doesn't even have sound.

You wouldn't solder pins to the ceramic without mech support. 'Modern'
commercial hybrids count on c-clip attachment for inline side attach -
older ones were brazed.

I suppose you could attach an IC to the board any way you pleased.
Spot welding would be good, if you could do it right every time and
had the budget.

The combination you suggest was used isn't impossible, or bad, it's
just uncoordinated. As an FRU, it's a throw-away item anyways, if it
shows signs of misbehavior.

RL