Tom Del Rosso wrote:


Tom Del Rosso wrote:
Getting down into the details of the booster guidance computer from
IBM.
http://www.youtube.com/watch?v=vZhRb...em-uploademail

Pins are soldered to the hybrid substrate, and then the pins are welded to
the PC board. Somehow the welding did not melt the pins off the
substrate. (???)

If this is the same technology as some other stitch-bond gear, it is
done by ultrasonic welding, and pretty fast. I've also seen
boards that were a bit like wire-wrap, the chips were welded
to fat, round pins that stuck above the board on both sides.
The pins were maybe .050" diameter. Then, on the other side,
the wires were ultrasonically welded to the pins, right through
the insulation.

Jon