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Tom Del Rosso[_4_] Tom Del Rosso[_4_] is offline
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Default Apollo Saturn V LVDC Board Teardown!!!!!!!


Tim Williams wrote:
"Tom Del Rosso" wrote in message
...

Tim Williams wrote:
Spot welded? (I'll watch later)


But what temperature would that be at?


Well.. welding is welding, yes, but you get very different results
between highly localized and loosely generalized heating methods. In
order of HAZ (heat affected zone) size, smallest to largest: e-beam,
laser, spot, arc, torch, friction, induction, forge. (Give or take
various considerations for each process, but I think this is a pretty
typical ordering.)


Thank you. Friction is the one whose existence I learned of most recently.

I'm sure we can narrow it down to the first 3.


Ultrasonic welding and wedge bonding are pertinent examples also from
the electronics industry, being used for very small joints of course
(where heating cannot be tolerated, so spot welding is out).


I assumed even spot welding would have melted the solder 2mm away.

So how do you think those pins were welded by IBM in 1968?


Tim "spent years on RCM"


I spent a year there one day.


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