On Sun, 27 Oct 2013 02:53:20 -0400, "Tom Del Rosso"
wrote:


Tom Del Rosso wrote:
Getting down into the details of the booster guidance computer from
IBM.
http://www.youtube.com/watch?v=vZhRb...em-uploademail

Pins are soldered to the hybrid substrate, and then the pins are welded to
the PC board. Somehow the welding did not melt the pins off the substrate.
(???)

Pins are brazed within the ceramic form. Internal bonds are
stitch-bond gold or Al wire to pad, high temperature solder between
substrate and sputter/print patterned ceramic.

Ceramic carrier is simply reflowed to printed wiring.

RL