Hot air has been universally accepted as a favorable/preferred method for
assembly and rework applications.
Hot air (or hot, clean, dry nitrogen) and other methods also work well in
small production runs and repair work.

I have hot air nozzles which have an integral shield, specifically to direct
the hot air flow away from the IC package, and heat just the leads.. but
Lloyd has also missed that development which has been around for years, too.

Only LLoyd is insisting that his perfect method is the only method which can
or should ever be used.

He's essentially said that anyone who doesn't understand the paramount
significance is too stupid (dolt) to appreciate the true value of his shared
genius.

Sound familiar? It's the same egomaniacal blathering stance as gummer and a
few others here.

The more they babble, the more stupidity they reveal.

--
WB
..........


"Jon Elson" wrote in message
...
"Lloyd E. Sponenburgh" lloydspinsidemindspring.com wrote:



But none of the above equipment supplies a person with what's needed to
do 'masked' IR reflow, where the body of the chip may not be heated, only
the leads. (I know, you guys would put a germanium IR detector chip
through a wave soldering process... but I wouldn't)

OK, well, this is quite a bit more specialized than most
people are working with. I recently got a Weller WHA900 hot air
tool, and this works quite nicely for removing big FPGAs and such
without damaging the board. Not so clear about damage to the chips,
but it seems they can usually be reused, if that was the purpose of
the rework.

Since I need custom circuitry in every piece of automation I sell, I need
to do this a lot, and having to stop, design, and do isolation milling of
a different board every time I want to evaluate a chip would just be a
stupid waste of my time and my clients' money.

I have often done prototyping using a board that used the same land
pattern, even if it didn't use the same chip. (if it used the same
chip, then power and ground pins would be in the same place, a definite
bonus.)

I thought (from all the past bragging) that there were some serious,
component-level designers here. I was clearly wrong about that.

Well, I design stuff by assembling a bunch of off-the-shelf
components, if that is what you mean.

Jon