Uffe Bærentsen wrote in message
. ..
Den 28-06-2012 16:29, N_Cook skrev:

Transistors , in this case 1-amp-continuous "size" whatever the SO
designation of that is.
If I've not used hot air then a scalpel tip or needle point, as used
here,
wedged under , soldering iron melt solder a touch leting the pins
relieve
themselves away from the lands , repeat wedging/desolder until fully
free.
But this time the epoxy was more structural than just for placement.
I ended up breaking up the transistor body and the epoxy stayed
resolute.
Any advice for next time ? if relevant red colour and more than a
micro-dot
must have been under it as traces splurged out all around the body.

Have seen thermo curing glue used when SMD and leaded components are
used in a mix on a single sided PCB.
First step in production was to place all glue dots for smd.
Then place all SMD components and cure glue in a reflow oven.
Then place all leaded components and run through the wave solder machine.
In this proces both SMD and leaded components are soldered at the same
time and the glue is to assure that the SMD components do not fall of
during soldering.

BTW the glue was red.

--
Uffe



There was another feature of it I'd noted but dismised ,thinking it was just
due to thin film "dilution" of the colour. The exuding glue blobs around the
SMDs was bright red but the underlying thin material was more beige or peach
in colour - perhaps a side-effect of reflow oven and air exposure while
curing