Breaking epoxy glue spots before desoldering ICs
I've got inundated with work. I will be , sometime, taking some 1mm diameter
high carbon steel and grinding to a shallow tapering blade and then tapering
the edges a bit. Locally heating and trying to put in an elbow. Then a pair
of these could get in either side with 0.3mm gap and each turned to expand
to 1mm . I guess, would put in enough force to break some of the glue spots
at least, and not the traces
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