On Nov 28, 1:48*am, Jeff Liebermann wrote:
On Sun, 27 Nov 2011 19:20:15 -0500, "Tom Del Rosso"

wrote:
Still no industry standard? *Which alloy do you like for repair of new
boards?

Pick a solder formulation:
http://en.wikipedia.org/wiki/Solder#Solder_alloys
http://www.farnell.com/datasheets/315929.pdf
For general repair, when I must use RoHS solder, I have several rolls
of 0.031" 96.5% tin, 3.0% silver and 0.5% copper alloy with no clean
flux:
http://www.mcmelectronics.com/product/TENMA-21-1042-/21-1042
http://www.all-spec.com/products/KWLF27565.html
I have no clue if this solder is better or worse than any other type.
I bought a case fairly cheap, and plan to use it until it runs out.
There are cheaper formulations without the silver which might be
useful.

I also use 63% tin, 37% lead solder for older devices. *It works MUCH
better than the RoHS stuff. *I'll sometimes use it on boards that use
RoHS solder, but only if I suck off the RoHS solder first. *Mixing the
two solder types results in a dull dross-like mixture.

--
Jeff Liebermann * *
150 Felker St #D * *http://www.LearnByDestroying.com
Santa Cruz CA 95060http://802.11junk.com
Skype: JeffLiebermann * * AE6KS * *831-336-2558

I've wondered about this too. Are you saying that every time I do a
component level repair on a board that was built according to RoHS
specs I need to remove all the RoHS solder associated with that/those
components first? That would just about involve everything new that
comes from Europe or Asia wouldn't it? Lenny