On Thu, 31 Mar 2011 17:19:21 -0500, flipper wrote:
On Thu, 31 Mar 2011 14:38:44 -0700, Jim Thompson
wrote:
Any issues with soldering to an RoHS-compliant module with ordinary
60/40 solder?
...Jim Thompson
If you're talking a discrete 'module' then leading probably uses a
matte tin plating, which shouldn't be a problem for tin/lead solder.
Maybe need a bit more temp than with lead/tin plating to get good
wetting, but less than needed for lead free solder.
BGAs are another matter since they, if RoHS compliant devices, will
already have lead free solder bumps (often/usually SAC) and trying to
mix those with a tin/lead solder profile can be problematic, because
of the temperature mismatch, although solvable from what I hear.
This is hand-work, thru-hole. Only BGA's I ever see are on paper as I
figure out the wire-bonding/strap-welding ;-)
...Jim Thompson
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