Smitty Two wrote:

In article , "N_Cook"
wrote:

Where holes are drilled for thru-board components but of diameter far too
big , thru-hole plated , but no eyelet/inserts used to fill the gap. So
1N4001 size leads in holes twice their diameter and 1N4148 in holes twice
their diameter. So not a case of only one drill size for all. So in area
terms about 1 to 4 ratio of lead to solder. Bad enough practise with proper
solder but with PbF, ring cracks starting all over.
Is it to avoid mutiny by the by-hand board populators ?

It's just careless design. As a contract assembly house, I see stuff
like that all the time. Surface mount footprints the wrong size for the
component, radial through holes for axial components, etc. ad infinitum.
Quoted a one-off prototype board last week at 3 hours, took 17, due to
documentation (and a slew of other) problems.

EEs should be allowed a pencil and a paper napkin to sketch out the
schematic, but after that, the board layout and overall product design
should be turned over to someone who's actually familiar with
manufacturing practices.


We had a board house add 'thermal rings' to the mounting holes in a
500 MHz synthesizer. It played hell with the modules and sent the phase
noise through the roof but they said that they would no longer make them
the way we needed them. it also dropped the center frequency by about
100 MHz. I had to take some of the copper foil we used to seal the
shields on the modules and cover them, then solder them to the surface
and the plated through holes, till we could get the boards from another
supplier. They routinely made a couple dozen different boards for us,
prior to that. When they decided to change our layouts without
permission, we dropped them.


--
You can't fix stupid. You can't even put a Band-Aid™ on it, because it's
Teflon coated.