Where holes are drilled for thru-board components but of diameter far too
big , thru-hole plated , but no eyelet/inserts used to fill the gap. So
1N4001 size leads in holes twice their diameter and 1N4148 in holes twice
their diameter. So not a case of only one drill size for all. So in area
terms about 1 to 4 ratio of lead to solder. Bad enough practise with proper
solder but with PbF, ring cracks starting all over.
Is it to avoid mutiny by the by-hand board populators ?