Man at B&Q wrote:
On Jun 15, 7:27 pm, Andy Champ wrote:
The Natural Philosopher wrote:

Mil spec semiconductors have better seals and pay attention to
differential thermal coefficients in the packages.
Bumped into a chip once (NEC V40 IIRC) where the extended range one was
done on a bigger technology - 8 micron, not 5, or something like that.
Can't check, the book is at work.


If it was mil spec that may have had more to do with a mil qualified
production line not being available for the smaller geometry, or it
may be realated to radiation hardening.


usually a different packaging as well. Ceramic packages and special
glues take more extreme temp cycling than the trad epoxy style packages.


Mil spec is less about chip design, and more about selecting more
tightly. using more conservatively, and packaging better.

A lot of early car electronics failures were down to the fact that
designers simply did not appreciate how hostile and environment a car
engine compartment was. Ambient temps way up. Or way down overnight in
frost.. high G vibration, corrosive water and salt spray..voltage spikes
well over a hundred if any part of the ignition fed back into the
supply, and potential for high induced voltages on all inputs of any
impedance due to ignition, and starter motor EMF radiations..

It's a miracle it works at all.

MBQ