On Mon, 15 Feb 2010 18:28:26 +0800, "Royston Vasey"
wrote:

I'm trying to seal a printed circuit board into a PVC part I've turned out
on my lathe. The problem I'm having is the that the epoxy goes quite runny
as it goes through its curing process and some of it runs through small gaps
( 0.5mm) where I'd prefer it didn't.


I'm using CW177 resin & HY177 hardener in the 5:1 mix recommended.

The data sheet is he

http://www.meury.com.au/uploads/170666853166.pdf

I tried some rapid set epoxy (~90 seconds) but it turns to crap before I can
get it in where it needs to go.


It's not really practical to use anything else (like RTV, tape, hot glue or
wax etc) to seal the small gaps in the bottom of the assembly.

Has anyone played around with this type of problem?

thanks.

You can also get 5 and 30 minute epoxy. Either should be more viscous
than a casting resin, which is intended to be low viscosity to allow
bubbles to escape as well as fill small details.