"Michael A. Terrell" wrote in message
...

Bill McKee wrote:

For removing surface mount or high density flat packs this is the best
stuff.
http://www.chipquikinc.com/


Not for production work. A good hot air rework station did the job
faster and better.


I removed a lot of SMD ICs with solder wick. Clean most of the solder
off the pins, and use a very small tipped dental pick to see which leads
were loose. Then touch the ones that were, with a hot soldering iron and
lift them before the solder cools. I could pull a 288 pin IC in about a
minute, clean up the pads in about 30 seconds, and solder a new chip in
by hand in, in about 90 seconds without any solder bridges. It took
longer to clean the board than to change a chip.


--
Greed is the root of all eBay.

But there is a large difference between production work and having to change
one IC in a lab or off site.