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mickgeyver mickgeyver is offline
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Default What can I do to keep this board from warping?

On Sep 25, 8:35*pm, Archimedes' Lever
wrote:
On Fri, 25 Sep 2009 16:02:55 -0700 (PDT), mickgeyver

wrote:
I'm trying to make a 10x scope probe that is capable of dealing with
slightly higher voltage levels of about +/- 20v yet at a high
impedance ~20Meg. This link "http://picasaweb.google.com/
UncleAltheKiddiesPal/Probe?feat=directlink" has some photo's showing
the probe and board warpage. The board was made from double sided
0.020-inch stock etched with a PCB milling machine (perhaps part of
the problem). It is (obviously) hand assembled. *I would appreciate
any tips or techniques that I could use to keep this board from
turning into a potato chip during assembly.


Thank you.


al


* Use 0.032" media. *Bake under a flat press upon receipt of the bare
boards.

I'll try to find thicker stock. Like Joerg there is no expense money
available for this project so I gotta use whatever is available.
There is a connector on the other end that I'm using to leech power
from the scope so I have limitations here.

* Hand assemble... *no wave solder, no IR oven.

Done that. Perhaps if I make a frame to clamp it flat during assembly.

* Those are the only techniques that yield 100% positive results.

* Any automated process will certainly have a poorer prime pass yield.

* That is, unless the PCB maker was real good at stress relief during the
making of the boards.

I'm the PCB maker all contained in house with a mill machine.