The idea is not to melt everything, but only to reconnect any shaky pad
and destroy possible tin whiskers (this is an early lead-free design).
Recommendations regarding prerequisites, choice of air gun vs oven,
and safe temperature cycles for this particular purpose would be
appreciated

If there is any hope of the board working again, this would mostlikely
exterminate all hope. There are many factors of the sudden death syndrome.
some could be solder and tin whisker related.. However, with the heating
and cooling cycles of laptops, delaminated contacts and broken traces on the
inner layers of the board would seem morelikely. Reflow won't help those
situations. Heating can cause solder to move away from the contact points.
If you've ever seen some of the early 90 model TVs, a lot of the picture
problems I found on those sets was witht the CRT socket solder connections.
Crt heats up, melts the solder, solder moves away from the pad and creates
gaps between the pin and pad.





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