MOSFET punch-through - ExFets.jpg
In message , John Larkin
writes
Actually, TO-247s do do that. Compaq 386 PSU with Aluminium case,
IRFP450 devices, they used to punch through the metal back plate and
also through the heatsink they were attached to, often the molten ejecta
solidified and fixed the device firmly to the heatsink.
[ A UUEncoded file (ExFets.jpg) was included here. ]
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Clint Sharp
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