Ross Herbert wrote:

Not in this case it isn't. This is the result of failing to clean the
flux away at all after a manual part placement and soldering
procedure. Such instances may occur when an OEM does not trust that
reflow or wave soldering will be ultra reliable where heavy component
leads are involved. The reflow time has to be adequate to ensure
proper wetting of the heavy leads but where other very small componets
may be damaged by heat this is not recommended. The reflow time is
always set to ensure the most sensitive components will not be damaged
by heat and this may require that heavy leaded components are fitted
manually afterwards.

The result of inadequate cleaning after finished board manufacture is
usually a much lighter white ring or anulus of residue, nothing as
thick or heavy as in the picture.

This is more like what you are talking about
http://www.residues.com/pdf/white_residue1.pdf


Ross, we manufactured both surface mount and through hole boards,
plus some items like connectors were hand soldered on our surface mount
PC boards. We had a VERY high standard of cleaning, because most of our
equipment was sold to the aerospace industry. I've seen probably every
possible defect in a new PC board, including a batch we received with a
missing internal power plane. I have seen this exact type of residue on
boards that just came out of the dryer, after being washed.


--
Service to my country? Been there, Done that, and I've got my DD214 to
prove it.
Member of DAV #85.

Michael A. Terrell
Central Florida