Eeyore wrote in message
...


Jan Panteltje wrote:

Joe Chisolm wrote

Dr Howard Johnson (High Speed Digital Design) had this article in
his email newsletter (and posted on his site). Interesting read.
Rollback RoHS: http://www.sigcon.com/Pubs/news/10_01.htm

Well seems [all] we have to [do is] make some traces .65mm apart :-)

Some ? ALL !

Goodbye microelectronics.

I just came across this too.
http://en.wikipedia.org/wiki/Tin_pest

" At 13.2 degrees Celsius (about 56 degrees Fahrenheit) and below, pure
tin
transforms from the (silvery, ductile) allotrope of beta-modification
white tin
to brittle, alpha-modification grey tin. Eventually it decomposes into
powder,
hence the name tin pest."


Graham



So when I pull , with just finger tension, a component lead through what was
a lead-free solder joint only a year or so before and there is a grey
powdery looking surface to the lead where it had been inside the solder
joint - is that "tin pest" ?


--
Diverse Devices, Southampton, England
electronic hints and repair briefs , schematics/manuals list on
http://home.graffiti.net/diverse:graffiti.net/