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[email protected] DGoncz@alum.mit.edu is offline
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On Jun 23, 10:31 pm, Brian Lawson wrote:
Hey Doug,

Nice of you to pop in once in a while, but what's this latest about,
or is it just point of interest you are sharing??


On Sat, 23 Jun 2007 16:01:27 -0700, wrote:
A self-study in composite and laminate materials and manufacture.


http://www.acmanet.org/bsa/index.cfm


Hi, Brian!

I am studying to laminate 1 mm thick aluminum and a Masonite or
acrylic base panel for high-power circuit boards for the MOEPED, then
etch the laminate with lye to form traces. Wilson Metalaminate product
may do for some, but one project is more than 1000 A. A copper circuit
board just won't do. These traces are 10x thicker than 4 mil copper,
but are a bit less conductive.

Doug