On Wed, 30 Aug 2006 22:49:02 +0100, "3T39"
Gave us:

Of course the mechanical strength of a solder join like this is
a bit questionable

Not if one follows the pre-tin operation with a drop of flux
(microdrop) on the wire or pin. Then, the reflow operation is
pristine. Crisp and clean, no caffeine. :-]