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SMT By Hand
Hi,
Im just starting to build some boards specifically using MCU's and other components, some of the components I wish to use only come in fine pitch SMT packages. I have looked into reflow and how the components are normally attached to boards using solder past (solder cream) and then put though a oven that controls the heating up and reflow and cool down process carefully. I noticed that most components im looking at have a heat up to 150Ëš C at 1 to 3 degrees a second to ensure not to damage the component. Now as far as I can see I only have 2 options to using such components: 1.) build a small reflow oven that is computer controlled and can be programmed based on the components Im using, this option is not expensive but is extremely time consuming. 2.) pay for a shop to fabricate the boards (which is expensive when dealing with small quantities). I was wondering if its possible to place such components using a hot air pencil, but these will obviously heat the component up very quickly, based on the reflow specs I assume this would damage the components? Any other fast and not so expensive options? Thanks for your time. |
SMT By Hand
On Jan 7, 3:37Â*am, wrote: Hi, Â* Â* Im just starting to build some boards specifically using MCU's and other components, some of the components I wish to use only come in fine pitch SMT packages. I have looked into reflow and how the components are normally attached to boards using solder past (solder cream) and then put though a oven that controls the heating up and reflow and cool down process carefully. I noticed that most components im looking at have a heat up to 150Ëš C at 1 to 3 degrees a second to ensure not to damage the component. Now as far as I can see I only have 2 options to using such components: 1.) build a small reflow oven that is computer controlled and can be programmed based on the components Im using, this option is not expensive but is extremely time consuming. 2.) pay for a shop to fabricate the boards (which is expensive when dealing with small quantities). I was wondering if its possible to place such components using a hot air pencil, but these will obviously heat the component up very quickly, based on the reflow specs I assume this would damage the components? Any other fast and not so expensive options? Thanks for your time. I also have done a great deal of rework involving surface mount devices (large devices with VERY fine pitch) and the previous directions are good. The only thing that I could add would be to suggest that you get a flux pen and apply a good liberal coating of flux to the pads and the pins before you start soldering. The flux will make the solder bead better and greatly reduce the number of shorts that you get between pins. Then you can use a flux cleaner when you are done to clean the excess flux off of the board. This is very much within the realm of the home hobbyist if you use a good iron, magnification of some kind, good lighting, and take your time. |
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