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Electronics Repair (sci.electronics.repair) Discussion of repairing electronic equipment. Topics include requests for assistance, where to obtain servicing information and parts, techniques for diagnosis and repair, and annecdotes about success, failures and problems. |
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#41
Posted to sci.electronics.components,sci.electronics.design,sci.electronics.repair,alt.engineering.electrical
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Replacement LED?
krw wrote: Michael A. Terrell wrote: How were the new caps stored? If it is where they can adsorb moisture, you can damage them with an iron that is too hot. I haven't had any problems with cracking but I used to have problems with end caps falling off. I haven't seen the issue for some time, though perhaps it was a problem with the manufacturer. Our purchasing group prefers Murata, so that's what I use (GRM series). We pre baked some boards and other components before assembly and reflow. That eliminated cracked multilayer SMD capacitors, tombstoning of two lead components and losing end caps. That was in N Central Florida which has plenty of humidity problems. The so called HVAC 'engineers' were clueless about how to control the humidity, so we had to resort to baking. LSI SMD ICs were backed and heat sealed into antistatic bags with moisture adsorbing packets. |
#42
Posted to sci.electronics.components,sci.electronics.design,sci.electronics.repair,alt.engineering.electrical
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Replacement LED?
On Fri, 01 Apr 2016 17:21:31 -0400, "Michael A. Terrell"
wrote: krw wrote: Michael A. Terrell wrote: How were the new caps stored? If it is where they can adsorb moisture, you can damage them with an iron that is too hot. I haven't had any problems with cracking but I used to have problems with end caps falling off. I haven't seen the issue for some time, though perhaps it was a problem with the manufacturer. Our purchasing group prefers Murata, so that's what I use (GRM series). We pre baked some boards and other components before assembly and reflow. That eliminated cracked multilayer SMD capacitors, tombstoning of two lead components and losing end caps. That was in N Central Florida which has plenty of humidity problems. The so called HVAC 'engineers' were clueless about how to control the humidity, so we had to resort to baking. LSI SMD ICs were backed and heat sealed into antistatic bags with moisture adsorbing packets. Sure, baking humidity sensitive parts is common before pick-n-place. It's a bit less common when hand (de)soldering, though. ;-) |
#43
Posted to sci.electronics.components,sci.electronics.design,sci.electronics.repair,alt.engineering.electrical
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Replacement LED?
krw wrote: On Fri, 01 Apr 2016 17:21:31 -0400, "Michael A. Terrell" wrote: krw wrote: Michael A. Terrell wrote: How were the new caps stored? If it is where they can adsorb moisture, you can damage them with an iron that is too hot. I haven't had any problems with cracking but I used to have problems with end caps falling off. I haven't seen the issue for some time, though perhaps it was a problem with the manufacturer. Our purchasing group prefers Murata, so that's what I use (GRM series). We pre baked some boards and other components before assembly and reflow. That eliminated cracked multilayer SMD capacitors, tombstoning of two lead components and losing end caps. That was in N Central Florida which has plenty of humidity problems. The so called HVAC 'engineers' were clueless about how to control the humidity, so we had to resort to baking. LSI SMD ICs were backed and heat sealed into antistatic bags with moisture adsorbing packets. Sure, baking humidity sensitive parts is common before pick-n-place. It's a bit less common when hand (de)soldering, though. ;-) We had a high failure rate on hand soldered FIR chips, before we started baking them. The bottom of the packaging was the thinnest, and it would bow out as it released steam during hand soldering. No one in EE or ME believed me, until I finally got them to try it for themselves. |
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