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Electronics Repair (sci.electronics.repair) Discussion of repairing electronic equipment. Topics include requests for assistance, where to obtain servicing information and parts, techniques for diagnosis and repair, and annecdotes about success, failures and problems. |
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#1
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Chip Maxim
Hi all For solder this chip, Maxim 1987, on to laptop Hp Compaq NC series, is a square of 6 mm side, 12 pin side, think that you succeed with a soldering iron with fine tip, or it could go one better hotgun? The lead free? or not, must be many mm? and paste flux soldering? Which approach do you recommend? Thanks in advance Regards http://radek.chlip.com/files/nc/zdj/IMG_2216.jpg http://obrazki.elektroda.net/0_1206512210.jpg http://radek.chlip.com/files/nc/nc.html |
#2
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Chip Maxim
In article ,
"SD" gfegk@gfdsd wrote: Hi all For solder this chip, Maxim 1987, on to laptop Hp Compaq NC series, is a square of 6 mm side, 12 pin side, think that you succeed with a soldering iron with fine tip, or it could go one better hotgun? The lead free? or not, must be many mm? and paste flux soldering? Which approach do you recommend? Not lead free. Liquid flux. .015" solder. Fine tip soldering pencil. 800F. I'll leave the conversions to your systems of measurement up to you. I'll add this caveat: If you had to ask those questions, you may not be qualified to make the repair. |
#3
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Chip Maxim
Not lead free. Liquid flux. .015" solder. Fine tip soldering pencil. 800F. I'll leave the conversions to your systems of measurement up to you. I'll add this caveat: If you had to ask those questions, you may not be qualified to make the repair. Thanks Recommend some soldering technique? Regards |
#4
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Chip Maxim
On 3/23/2011 9:03 AM, SD wrote:
Not lead free. Liquid flux. .015" solder. Fine tip soldering pencil. 800F. I'll leave the conversions to your systems of measurement up to you. I'll add this caveat: If you had to ask those questions, you may not be qualified to make the repair. Thanks Recommend some soldering technique? Regards Plenty of help on Youtube : http://www.youtube.com/watch?v=3NN7UGWYmBY JC |
#5
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Chip Maxim
On 3/23/2011 12:22 PM, Archon wrote:
On 3/23/2011 9:03 AM, SD wrote: Not lead free. Liquid flux. .015" solder. Fine tip soldering pencil. 800F. I'll leave the conversions to your systems of measurement up to you. I'll add this caveat: If you had to ask those questions, you may not be qualified to make the repair. Thanks Recommend some soldering technique? Regards Plenty of help on Youtube : http://www.youtube.com/watch?v=3NN7UGWYmBY JC I'd suggest trying your technique on scrap boards first, old hard drives are a useful source. JC |
#6
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Chip Maxim
This same IC was asked about, here on SER, not long ago.. probably for the
same application, as there were lots of search results wrt flexing boards making this IC's connections open. The package of this IC is 40-pin? Thin QFN 6mmx6mm.. there are no leads on this IC package, click image for a larger pictu http://www.pchub.com/uph/laptop/507-...-Power-IC.html Hot air reflow would be a good approach, but tinning the IC pads and the board pads with leaded solder, then placing/holding the IC in position, should allow someone who's fairly well skilled at soldering to reflow the connections with a low-to-medium heat soldering iron equipped with a fine tip. Trying to apply/add solder to the individual pads with the IC in place could easily cause shorts/bridges between the contacts, which could require removal of the IC to remove the excess solder. If the board pads have enough lead solder applied to them, just applying some liquid flux, then positioning the IC and touching the contacts with a fine tip of a soldering iron would likely be a reasonable method of reflowing the connections. For small components and/or fine pitch ICs, I avoid adding solder with the part in position since it's too easy to apply too much solder.. instead, I try to make sure that the board contacts have enough solder, and after applying liquid flux, it's easier to just reflow the contacts. -- Cheers, WB .............. "SD" gfegk@gfdsd wrote in message ... Hi all For solder this chip, Maxim 1987, on to laptop Hp Compaq NC series, is a square of 6 mm side, 12 pin side, think that you succeed with a soldering iron with fine tip, or it could go one better hotgun? The lead free? or not, must be many mm? and paste flux soldering? Which approach do you recommend? Thanks in advance Regards http://radek.chlip.com/files/nc/zdj/IMG_2216.jpg http://obrazki.elektroda.net/0_1206512210.jpg http://radek.chlip.com/files/nc/nc.html |
#7
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Chip Maxim
The bga solder balls? can be solder with solder iron? Recommend me some type of solder balls for this chip Maxim. Thanks Regards |
#8
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Chip Maxim
SD wrote:
Hi all For solder this chip, Maxim 1987, on to laptop Hp Compaq NC series, is a square of 6 mm side, 12 pin side, think that you succeed with a soldering iron with fine tip, or it could go one better hotgun? The lead free? or not, must be many mm? and paste flux soldering? Which approach do you recommend? Thanks in advance Regards http://radek.chlip.com/files/nc/zdj/IMG_2216.jpg http://obrazki.elektroda.net/0_1206512210.jpg http://radek.chlip.com/files/nc/nc.html Where did you buy the chip you are trying to install?? I have a board that needs the chip replaced, and I might try it if I could get a chip. |
#9
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Chip Maxim
My guess is that the board manufacturer uses paste to hold the IC in place,
then heats the board. Search "QFN stencil" and "QFN soldering". http://www.solder.net/stencilmate.asp http://blog.screamingcircuits.com/20...e_qfn_dfm.html http://store.curiousinventor.com/gui...Soldering/QFN/ http://hackaday.com/2010/05/04/qfn-o...-solder-paste/ No balls should be needed.. the IC is not BGA, it's QFN. Hot air would most likely be ideal, but a soldering iron and skill could suffice. This type of repair is best accomplished by someone with skill and experience in SMT repairs. This is why I recommend liquid flux if enough solder is already in place.. then just touch the contacts and pads, moving around the IC (without trying to add solder). If the IC has been removed, I would apply a minimal amount of lead solder to the board pads, then with the IC in position (and liquid flux applied), carefully heat the contacts and pads. -- Cheers, WB .............. "SD" gfegk@gfdsd wrote in message ... The bga solder balls? can be solder with solder iron? Recommend me some type of solder balls for this chip Maxim. Thanks Regards |
#10
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Chip Maxim
In article ,
"Wild_Bill" wrote: If the IC has been removed, I would apply a minimal amount of lead solder to the board pads, then with the IC in position (and liquid flux applied), carefully heat the contacts and pads. I think it's counterproductive to apply solder first, which would serve to keep the chip off the board. I absolutely agree with the liquid flux idea, then a drop of solder on the iron and skate it down each edge. |
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